| MWIR Cooled Detector | 3–5 µm | Indium antimonide (InSb) or mercury cadmium telluride (MCT/HgCdTe) | Thermoelectrically or cryogenically cooled, commonly near 77–200 K depending on architecture | Typically below 20 mK in high-performance cooled systems | 320 × 256, 640 × 512, 1280 × 1024 and other custom formats | Gas-leak detection, high-temperature inspection, aerospace imaging, target signature analysis and scientific research | High sensitivity, fast response and strong performance for hot targets; requires cooling, thermal management and additional system complexity |
| MWIR Uncooled Detector | 3–5 µm | Specialized MCT, InSb or other narrow-band infrared sensing structures | Ambient-temperature operation or thermoelectric stabilization | Commonly higher than cooled MWIR systems; application-dependent | Small-format scientific arrays and application-specific focal-plane assemblies | Compact spectroscopy, industrial monitoring and portable instruments where cooling is restricted | Lower size, weight and power requirements, but generally lower sensitivity and more limited availability than cooled MWIR solutions |
| LWIR Cooled Detector | 8–12 µm or 8–14 µm | Mercury cadmium telluride (MCT/HgCdTe) or quantum-well infrared photodetector structures | Cryogenic or thermoelectric cooling, depending on required sensitivity and integration time | Typically below 25 mK in high-performance cooled systems | 320 × 256, 640 × 512, 1280 × 1024 and custom scientific formats | Long-range surveillance, aerospace payloads, low-temperature research, hyperspectral imaging and precision thermography | Excellent sensitivity and spectral selectivity; cooling requirements increase cost, power consumption and mechanical complexity |
| LWIR Uncooled Microbolometer | 8–14 µm | Vanadium oxide (VOx) or amorphous silicon (a-Si) | Ambient-temperature operation; optional thermal stabilization for improved uniformity | Approximately 20–80 mK for many commercial imaging systems | 160 × 120, 320 × 256, 384 × 288, 640 × 512 and 1280 × 1024 | Building inspection, predictive maintenance, firefighting, security, automotive assistance and handheld thermal cameras | Low size, weight and power; no cryogenic cooler is required, but response speed and sensitivity are generally below cooled photon detectors |
| LWIR Thermopile Array | Approximately 8–14 µm | Silicon-based thermopile elements with infrared absorber structures | Ambient-temperature operation | Usually higher than microbolometer systems and strongly dependent on optical design | Single-pixel, 8 × 8, 16 × 16 and other low-resolution arrays | Contactless temperature measurement, occupancy sensing, HVAC control and basic presence detection | Very low power and simple integration; lower spatial resolution makes it unsuitable for detailed thermal imaging |
| LWIR Pyroelectric Detector | Broad LWIR response, often covering 8–14 µm | Pyroelectric ceramics or crystals, including triglycine sulfate-based materials | Ambient-temperature operation | Specified by signal-to-noise ratio and modulation frequency rather than standard camera NETD alone | Single-element or small multi-element arrays | Motion detection, flame monitoring, gas analysis and modulated infrared measurement | Detects changes in infrared radiation rather than stable scenes; requires target or optical modulation for many applications |
| Dual-Band MWIR/LWIR System | Typically 3–5 µm and 8–12/14 µm | Separate InSb/MCT and LWIR MCT or microbolometer focal-plane assemblies | Usually cooled when high MWIR performance is required; hybrid architectures are possible | Determined independently for each spectral channel | Commonly 320 × 256, 640 × 512 or larger synchronized formats | Multi-spectral surveillance, combustion analysis, atmospheric research and advanced target recognition | Provides complementary spectral information, but requires optical co-registration, calibration, synchronization and more complex electronics |