Basic Sensor Node Low-power monitoring, simple local decisions | 8-bit or 32-bit MCU; typically below 100 MHz; low interrupt and arithmetic demand | 3.3 V logic; 5 V may be required by selected sensors or actuators | GPIO, I²C, SPI, UART; optional low-power wireless or RS-485 | 16–256 KB flash; 2–32 KB RAM; optional nonvolatile data memory | Millisecond-level response; sleep and wake-up modes are important | Commercial: 0–70°C; industrial option: approximately −40–85°C | Brownout reset, watchdog timer, reverse-polarity protection, input filtering | Select a compact, low-power MCU board with sufficient GPIO, ADC channels, sleep current, and connector protection. |
Motor and Motion Controller Position, speed, or torque control | 32-bit MCU; typically 100–300 MHz; hardware timers, PWM, encoder capture, and fast interrupts | 3.3 V logic; separate motor bus commonly ranges from 12–48 V depending on the drive stage | High-resolution PWM, ADC, quadrature encoder, CAN or RS-485, digital I/O | 128 KB–2 MB flash; 32–512 KB RAM; optional external position or event memory | Deterministic control loops typically from tens of microseconds to a few milliseconds | Industrial: approximately −40–85°C; vibration and electrical noise must be evaluated | Cycle-by-cycle overcurrent response, hardware fault input, watchdog, current and temperature monitoring | Choose a board with synchronized PWM, fast ADC triggering, encoder peripherals, isolated communication options, and strong grounding. |
Industrial I/O Controller Machine sequencing and distributed automation | 32-bit MCU or real-time processor; approximately 100–400 MHz; moderate multitasking | 24 V field power commonly converted to 5 V and 3.3 V logic rails | Digital inputs and outputs, 0–10 V or 4–20 mA analog I/O, RS-485, CAN, Ethernet | 256 KB–4 MB flash; 64 KB–1 MB RAM; nonvolatile fault and configuration storage | Deterministic scan or task cycle, commonly 1–20 ms depending on I/O count and control complexity | Industrial temperature range; immunity to surge, EFT, ESD, and conducted noise is essential | Galvanic isolation, protected 24 V inputs, output short-circuit protection, event logging, safe-state outputs | Define channel count, isolation groups, voltage/current ranges, update rate, connector spacing, and field-wiring protection first. |
Connected Gateway Protocol conversion, remote monitoring, edge data collection | 32-bit MCU with networking capability or application processor; approximately 200 MHz and above for richer protocols | 5 V input with 3.3 V logic; provide a controlled power path for radios and storage devices | Ethernet, USB, UART, RS-485, CAN; optional Wi-Fi, cellular, or other wireless connectivity | 1–16 MB flash for MCU designs; 256 MB or more may be required for embedded Linux; external eMMC or industrial-grade storage | Communication latency is usually more important than sub-millisecond control determinism | Commercial or industrial temperature; enclosure, antenna, and connector sealing affect the final rating | Secure boot, signed firmware, encrypted communication, hardware key storage, surge protection, and remote update recovery | Choose the operating system and update strategy before sizing memory, storage, Ethernet performance, and security hardware. |
Human–Machine Interface Controller Display, touchscreen, local visualization | Application processor or high-performance MCU; graphics acceleration may be required for complex interfaces | 5 V input; 3.3 V logic; display backlights may require a separate regulated supply | MIPI DSI, RGB, or LVDS display interface; USB, touch interface, audio, Ethernet, and service UART | At least 64 MB RAM for many embedded graphics workloads; additional flash or eMMC for the operating system and assets | User-interface responsiveness generally targets tens of milliseconds; safety functions should not depend solely on the display | Brightness, viewing angle, thermal dissipation, and touchscreen operation with gloves may be key requirements | Independent emergency-stop path, display watchdog, protected USB ports, controlled startup, and secure software access | Select the board after defining display resolution, frame rate, operating system, boot time, touch method, and enclosure constraints. |
Safety-Critical or High-Reliability Controller Equipment where a fault can create significant risk | MCU with documented safety features; lockstep cores, memory protection, ECC, or independent monitoring may be required | Supervised input rail with undervoltage, overvoltage, and reset monitoring; separate safety power path where required | Redundant or monitored I/O, safety communications where applicable, diagnostic interfaces, and independent fault lines | ECC-protected memory where needed; traceable firmware storage; protected boot configuration | Bounded execution time, fault detection coverage, defined safe state, and verified reset behavior | Temperature, vibration, EMC, and component derating must be established from the risk and reliability analysis | Independent watchdog, clock monitoring, memory tests, diagnostic coverage, redundancy, fault logging, and controlled shutdown | Define the required safety integrity, diagnostic coverage, failure response, and development evidence before selecting the PCB. |
Battery-Powered Portable Device Mobile instrumentation or handheld control | Low-power 32-bit MCU or processor; performance selected around duty cycle and peak workload | Single-cell battery systems commonly use a regulated rail near 3.3 V; charging and protection circuits are required | GPIO, ADC, SPI, I²C, USB, display or touch interface; wireless connectivity may be optional | 256 KB–2 MB flash for MCU firmware; RAM sized for buffers, display, and communication stacks | Fast wake-up, low standby current, and predictable peak-current behavior | Temperature range must include battery charging and discharging conditions; mechanical shock may be significant | Battery protection, fuel gauging, thermal monitoring, brownout handling, secure storage, and low-power recovery modes | Prioritize measured energy per operating cycle, sleep current, thermal limits, enclosure volume, connector durability, and charging safety. |